SWIFT marks key advancement in Lockheed Martin and Altera partnership

Written by Copernical Team Wednesday, 09 October 2024 20:54

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Los Angeles CA (SPX) Oct 08, 2024

Lockheed Martin (NYSE: LMT), in collaboration with Altera, an Intel company, has successfully demonstrated its 12th Generation Electronic Warfare (Gen12) transceiver in a flight test using Altera's Agilex 9 Direct RF FPGA. This test, known as the SHIP-enabled Wideband Transceiver Integrated Flight Test (SWIFT), was conducted under the Office of the Under Secretary of Defense for Research and Eng

SWIFT marks key advancement in Lockheed Martin and Altera partnership
by Clarence Oxford
Los Angeles CA (SPX) Oct 08, 2024

Lockheed Martin (NYSE: LMT), in collaboration with Altera, an Intel company, has successfully demonstrated its 12th Generation Electronic Warfare (Gen12) transceiver in a flight test using Altera's Agilex 9 Direct RF FPGA. This test, known as the SHIP-enabled Wideband Transceiver Integrated Flight Test (SWIFT), was conducted under the Office of the Under Secretary of Defense for Research and Engineering (OUSD-R&E). The team met the ambitious challenge of demonstrating this electronic warfare capability aboard a Group 2 Unmanned Air Vehicle (UAV) within a 12-month timeframe.

Held at the U.S. Army's Yuma Proving Ground, the SWIFT demonstration marked the first government test using Lockheed Martin's Gen12 transceiver equipped with the Altera Direct RF FPGA. The transceiver successfully carried out Electronic Support (ES) operations, detecting, identifying, and locating enemy emitters in a Department of Defense (DoD)-relevant environment. This accomplishment showcased the readiness of Altera's FPGA for operational missions.

The demonstration highlighted how electronic warfare systems can be integrated into airborne platforms with strict size, weight, and power (SWaP) constraints, while leaving room for future upgrades. The system utilizes a low-SWaP, Sensor Open System Architecture (SOSA)-aligned digital transceiver, and performs both Electronic Support (ES) and Electronic Attack (EA) missions using domestically produced semiconductors.

This achievement underscores the significance of the OUSD-R&E's State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program, which focuses on producing U.S.-made microelectronics tailored for DoD applications.

At a subsequent event at Lockheed Martin's Global Vision Center in Virginia, the success of the SWIFT demonstration was presented as a milestone in transitioning Altera's Direct RF FPGA technology into various DoD programs of record.

Dr. Steven Walker, Lockheed Martin's vice president and chief technology officer, commented, "This demonstration signifies an important step forward for Lockheed Martin's strategic partnership with OUSD-R&E and Altera on ensuring warfighter access to state-of-the-art, U.S.-made microelectronics. The SHIP program's transformative influence on DoD capabilities bolsters confidence in these ongoing advancements and paves the way for their integration throughout the military in support of our customers' most critical missions."

John Sotir, Senior Director of Military Aerospace and Government Business at Altera, added, "Altera's proud to participate in Lockheed Martin's demonstration along with OUSD-R&E SHIP program. Leveraging decades of leadership in chiplet development and manufacturing has led to the rapid readiness and availability of production quality, SWAP-centric MCP-2 products for future mission requirements."

The SWIFT demonstration highlights the potential for continued industry collaboration to meet DoD goals using U.S.-built semiconductors. The technology holds promise for various applications, including delivering targeting data and situational awareness to allied forces.

Lockheed Martin plans to continue demonstrating the Gen12's ES and EA capabilities, targeting near-term integration into DoD Programs of Record. The SHIP program remains at the forefront of efforts to secure U.S.-made, trusted microelectronics capable of significant SWaP reductions.

As part of this initiative, Altera developed several Multi-Chip Packages (MCPs), including the MCP-2, in record time, with Lockheed Martin serving as an early partner for the MCP-2's transition through the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) contract. Under this contract, Altera's MCP-2 chip was adapted for electronic warfare applications, expediting the delivery of these capabilities to the warfighter.