by Clarence Oxford
Los Angeles CA (SPX) Jul 25, 2024
The Next-Generation Microelectronics Manufacturing (NGMM) program is set to revolutionize U.S. microelectronics production through a new agreement to establish the first national center dedicated to advancing domestic microelectronics manufacturing.
DARPA is collaborating with the University of Texas at Austin and its Texas Institute for Electronics research center to form a consortium supporting 3D heterogeneous integration (3DHI) microsystems research, development, and low-volume production. Building on the foundational research from Phase 0, NGMM's next two phases aim to create a domestic capability that addresses key challenges and bolsters U.S. technological leadership and innovation.
"We're holistically addressing tomorrow's challenges and solutions. That starts with an onshore, open-access center for 3DHI microsystems prototyping and pilot line manufacturing," said Dr. Whitney Mason, director of DARPA's Microsystems Technology Office. "This accessibility to researchers from academia, government, and industry will break down silos and foster an ecosystem that enhances the U.S. competitive advantage."
The consortium will bring together a wide range of organizations-including the defense industrial base, domestic foundries, vendors, startups, designers, manufacturers, academia, and other stakeholders-to achieve a shared vision of national and economic security.
DARPA's microelectronics R and D efforts align with broader government initiatives to secure microchip supply chains but are funded separately from the CHIPS and Science Act of 2022. NGMM, financed by the Defense Department budget, focuses on long-term technologies for national security and commercial applications, with cross-collaboration playing a crucial role in building onshore capacity.
"We can't overstate the need for constant and unwavering forward momentum in microelectronics capabilities. The CHIPS Act's near-term emphasis can help reinforce NGMM's work toward realizing the next major wave of microelectronics innovation," Mason said. "Supply chain resilience and reducing overseas reliance requires working together as a community, with both traditional and non-traditional members. That's what this program is about."
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