by Robert Schreiber
Berlin, Germany (SPX) Mar 22, 2024
Sivers Semiconductors AB (STO: SIVE) has announced the expansion of its collaboration with a premier European Satellite Company through Sivers Wireless, marking the signing of a third product development contract. This latest agreement, valued at approximately $4.73 million, focuses on the creation of next-generation beamformer chipsets slated for development throughout 2024 and 2025, with an anticipated transition to mass production in the fourth quarter of 2025.
These advanced beamformers, enhanced with new features and capabilities, build on the foundation laid by the initial beamformers developed under the first agreement with this customer in December 2020, which are currently in widespread production.
Additionally, an existing project initiated in December 2022, encompassing the development of various chipset technologies to complement the beamformers, has seen an increment in its value by around $2 million over the past year, bringing its total to $16.4 million. This project, now extended by approximately one year due to the re-prioritization of one of the chipsets, anticipates the completion of development within the next 18 months, with $7.4 million in development revenue yet to be recognized before proceeding to mass production.
Sivers Semiconductors, recognized for its expertise in advanced Beam Former Integrated Circuits (BFICs) for SATCOM ground terminals, is positioned to capitalize on the growing demand across a variety of SATCOM terminal applications, from Defense to Enterprise, driven by the global need for ubiquitous connectivity. This third collaboration underscores Sivers' expanding influence within the SATCOM industry.
"Strengthening our strategic alliance with this key customer underscores our dedication to forging the future of global connectivity. This latest endeavor further solidifies our role at the forefront of SATCOM innovation," remarked Anders Storm, Group CEO of Sivers Semiconductors.
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