by Clarence Oxford
Los Angeles CA (SPX) Mar 19, 2024
Frontgrade Technologies, a pioneer in mission-critical electronics for the aerospace and defense sectors, has unveiled a groundbreaking plastic-encapsulated Arm Microcontroller targeted at the burgeoning space industry. Set for flight grade production by July 2024, this innovation is poised to meet NASA's PEM INST-001 Level 2 qualification, a benchmark for plastic-encapsulated microcircuits' radiation tolerance and reliability, essential for enduring the severe conditions of New Space Missions.
Dr. J. Mitch Stevison, President and CEO of Frontgrade Technologies, highlighted the growing satellite demand for Low Earth Orbit (LEO) missions, emphasizing the necessity for components that promise high reliability, efficient Size, Weight, Power, and Cost (SWaP-C) characteristics, along with radiation protection. "Our latest offering, which meets NASA's Space PEM Level 2 standards, reaffirms our commitment to supplying high-reliability, radiation-assured components crucial for vital space missions," he stated.
Designed for seamless integration, Frontgrade's plastic Arm Microcontroller features a compact design and is built on the robust Arm Cortex M0+ 32-bit processor, leveraging RISC-based architecture. Its adherence to industry-standard Arm technology equips developers with sophisticated tools for application-specific development and debugging.
This microcontroller stands alone in the market by integrating dual independent CAN2.0B controllers, mission read/write flash memory, and system-on-chip capabilities. Such an amalgamation facilitates optimal board utilization, simplifying design complexities and trimming costs. Moreover, its rugged plastic ball grid array (BGA) packaging mirrors the input/output layout and functionalities of Frontgrade's ceramic QML Arm Microcontroller, ensuring a blend of durability and performance.
Related Links
Frontgrade Technologies
Space Technology News - Applications and Research